This document is a design support document from ROHM Co., Ltd, which introduces the features and characteristics of products in HTSOP-J package.
This ROHM design support document provides detailed information for the HTSOP-J semiconductor package. It covers package structure, material composition, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering processes.
The document also includes packing style, shipping specifications, peel‑back strength tests, and notes on missing ICs. All data are intended to help designers integrate the HTSOP-J package into their products while ensuring reliability and compliance with ROHM’s handling guidelines.
| Storage temperature range | 5 to 30 °C |
|---|---|
| Storage humidity range | 40 to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Solder iron temperature | ≤ 380 °C |
The recommended storage temperature is 5 °C to 30 °C.
The maximum reflow temperature is specified as 260 °C.
A solder iron temperature of 380 °C or less is recommended.
The specified storage period is one year.