This document provides detailed information on the dimensions of HSOP 25 and HSOP 28 packages.
This design support document from ROHM describes the HSOP semiconductor package, covering its structure, materials, and dimensional data for the HSOP25 and HSOP28 variants. It includes detailed information on tape‑and‑reel packaging, labeling, and shipping style.
Key technical data such as recommended storage temperature (5 °C – 30 °C), humidity (40 % – 70 % RH), reflow soldering profile (up to 260 °C), and peel‑back strength (0.2 – 0.7 N) are provided, along with footprint dimensions and recommended wave‑soldering conditions.
| Package type | HSOP |
|---|---|
| Lead frame material | Cu‑Alloy |
| Die material | Silicon |
| Maximum reflow temperature | 260 °C |
| Recommended preheat temperature range | 130 °C – 190 °C |
| Storage temperature range | 5 °C – 30 °C |
| Storage humidity range | 40 % – 70 % RH |
| Cover tape peel‑back strength | 0.2 – 0.7 N |
| Solder iron temperature limit | ≤ 380 °C |
The recommended storage temperature is 5 °C to 30 °C.
The maximum reflow temperature is 260 °C.
The cover‑tape peelback strength should be between 0.2 N and 0.7 N.
The solder iron temperature should be 380 °C or less.