This design support document is the package dimension drawing of HTSSOP-C64
This design support document describes the HTSSOP-C64 semiconductor package, including its structure, materials, and marking information. It also details packaging formats such as tape and reel, storage environment, and handling guidelines.
Key sections cover footprint dimensions, recommended reflow and wave soldering profiles, solder‑iron settings, and shipping specifications. The document serves as a technical reference for designers and manufacturers integrating the HTSSOP-C64 into their products.
| Package type | HTSSOP-C64 |
|---|---|
| Die material | Silicon |
| Die attach material | Ag Paste |
| Wire material | Au |
| Molding material | Epoxy Resin |
| Storage temperature range | 5 to 30 °C |
| Storage humidity range | 40 to 70 % RH |
| Maximum reflow temperature | 260 °C |
| Solder‑iron temperature limit | ≤ 380 °C |
| Package overall length | 17.2 mm |
The document specifies a storage temperature of 5 °C to 30 °C and a humidity range of 40 % to 70 % RH.
The recommended maximum reflow temperature is 260 °C.
After opening, the package should be assembled within 168 hours; if the storage period expires, bake at 125 °C for 24 hours.
Use a solder‑iron temperature of 380 °C or less and a mounting time of 4 seconds or less.