This document is a design support document from ROHM Co., Ltd., introducing the features and characteristics of their products. Please contact ROHM for more detailed product information and catalogs.
The document presents the external package information for the HVSOFS semiconductor, including a 3‑D view requirement and recommended conditions for viewing the data. It notes that the images are not to scale and that internal structure data must be requested separately.
Additional notes cover application guidance, stating the parts are intended for general‑use electronic equipment and are not radiation‑tolerant or suitable for safety‑critical systems. Copying or reproduction of the document is prohibited without ROHM's consent.
| Package type | HVSOFS |
|---|
No, the products specified in this document are not designed to be radiation tolerant.
No, copying or reproduction of any part of the document is prohibited without ROHM's consent.