This document is a design support document for the HTSSOP-B24 external package, which includes external dimensions and pin distribution information for reference by design engineers.
The document presents the external package information for the HTSSOP‑B24 semiconductor package, including recommended viewing conditions and a disclaimer about the data. It notes that the package images are not to scale and that a 3D‑enabled browser is required to view the content.
ROHM states that the package is intended for general‑use electronic equipment and is not radiation tolerant. Copying or reproducing the document without ROHM's consent is prohibited, and the company disclaims liability for any inaccuracies or misuse of the information.
| Package type | HTSSOP-B24 |
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No, the products specified in this document are not designed to be radiation tolerant.
No copying or reproduction of the document, in part or in whole, is permitted without ROHM's consent.