350000-11-RC Series Lead Free RoHS/WEEE Compliant SOIC DIP Adapters
The Aries 350000-11-RC series offers cost‑effective SOIC DIP adapters that can be used without redesigning the PCB layout. The adapters are available in various pin counts and center spacings to suit standard .300 in (7.62 mm) pitch boards.
Key specifications include FR406 or IS410 board material, ENIG pad finish, brass alloy pins, and a maximum operating temperature of 200 °C. Recommended PCB hole size and detailed dimensions for each pin count are also provided.
| Board material | .062 thick FR406 or IS410 |
|---|---|
| Copper thickness | 1 oz. on both sides |
| Pad finish | ENIG (Immersion Gold over Electroless Nickel) |
| Pin material | Brass Alloy 360 1/2 hard (UNS C36000) |
| Pin plating | 10 µin Gold, 100 µin Nickel |
| Maximum operating temperature | 200 °C |
| Recommended PCB hole size | .028 + .003 inches |
| Center spacing | .300 inches (7.62 mm) |
The adapter can operate up to 200 °C Max.
Pins are Brass Alloy 360 1/2 hard per UNS C36000.
Use a hole size of .028 + .003 inches in diameter.