Aries Series 354000 DIP to SOIC Adapter RoHS/WEEE Compliant Specification

This product is DIP to SOIC Adapters, which can be conveniently and cost-effectively converted from DIP style packaging to SOIC PC board layouts.


Aries Series 354000 DIP to SOIC Adapter RoHS/WEEE Compliant Specification - cover page
Brand
Aries
Category
Adapter
Document type
Datasheet
Language
English
Pages
1
File format
PDF
File size
247 KB
Published
12 May, 2012
Updated
30 September, 2023
MD5 checksum
F280A2672ED807F4A0D4FFDFEA3D597C

About this manual

The Series 354000 adapters provide a convenient, cost‑effective way to convert DIP style packages to SOIC PCB layouts. Aries offers custom options for materials, plating, sizes and configurations based on order quantity.

The sheet lists electrical and mechanical specifications such as socket material, pin plating, current rating, insertion force and recommended PCB solder pad dimensions, along with mounting considerations and ordering information.

What's inside

  • Features
  • Specifications
  • Mounting Considerations
  • Male Adapter Pin Detail
  • Collet Contact Detail
  • Ordering Information

Specifications

Socket body materialBlack UL 94V‑0 glass‑filled 4/6 nylon
Operating temperature221 °F (105 °C)
Contact current rating3 Amps
Insertion force per pin180 g (insertion), 90 g (withdrawal), 140 g (normal)
Recommended PCB solder pad widthMinimum 0.028 in (0.71 mm)

Frequently asked questions

What is the contact current rating of the adapter?

The adapter is rated for a contact current of 3 Amps.

What is the maximum operating temperature?

It can operate up to 221 °F (105 °C).

What solder pad size is recommended for the PCB?

A minimum pad width of 0.028 in (0.71 mm) is suggested.

What material is used for the male adapter pin?

The male adapter pin is made of Brass Alloy 360 1/2 hard.

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