MITSUBISHI RA07M0608M Manual

The RA07M0608M is a 7-watt RF MOSFET Amplifier Module for 7.2-volt portable radios that operate in the 66- to 88-MHz range. It features enhancement-mode MOSFET transistors, low-power control current, and a broadband frequency range.


MITSUBISHI RA07M0608M Manual - cover page
Brand
Mitsubishi
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
9
File format
PDF
File size
148 KB
Published
21 March, 2012
Updated
29 September, 2023
MD5 checksum
7D68E152F5D8CE841F09E01B4A0896D1

About this manual

The RAO7MO608M is a 7‑watt RF MOSFET amplifier module designed for 7.2 V portable radios operating in the 66‑88 MHz band. It uses enhancement‑mode MOSFET transistors and can be driven directly from a battery, with output power controlled by gate voltage or input power.

The document provides maximum ratings, electrical characteristics, typical performance curves, mechanical construction details, recommended mounting and thermal design, as well as safety and RoHS compliance information for reliable integration into RF equipment.

What's inside

  • Description
  • Maximum Ratings
  • Electrical Characteristics
  • Typical Performance
  • Outline Drawing
  • Test Block Diagram
  • Construction and Mounting
  • Thermal Design
  • Output Power Control
  • Safety and RoHS Compliance

Specifications

Frequency Range66 – 88 MHz
Output Power (typical)7 W
Drain Voltage (Vop)7.2 V
Gate Voltage (Vag) range0 – 5 V
Input Power (Pin)30 mW (typ)
Total Efficiency45 %
Package Size30 × 10 × 5.4 mm
Control Current (gate)1 mA (typ)
Heat‑sink flatness requirement< 50 µm
Mounting screw torque1.8 – 3.0 kgf·cm

Frequently asked questions

What is the recommended torque for the mounting screws?

The mounting screws should be tightened to a torque of 1.8 to 3.0 kgf·cm.

How sensitive is the RAO7MO608M to electro‑static discharge?

The module is sensitive to ESD voltages down to 1000 V and requires appropriate precautions.

What flatness is required for the heat sink when mounting the module?

The heat‑sink surface must be flatter than 50 µm to avoid cracking the ceramic substrate.

What is the maximum recommended case temperature for reliable operation?

For long‑term reliability the module case temperature should be kept below 90 °C (60 °C under standard conditions).

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