This document describes the features and characteristics of Kingston's KHX1600C9D3P1K2/8G memory modules, including capacity, timing parameters, electrical and mechanical specifications, etc.
The KHX1600C9D3P1K2/8G is an 8 GB (two 4 GB) DDR3‑1600 CL9 memory kit composed of two 512M × 64‑bit modules. It complies with JEDEC standards and supports Kingston HyperX Plug and Play (PnP) when the BIOS provides the required support.
Key specifications include a 1.5 V operating voltage (1.425 V ~ 1.575 V), CL9 latency, row cycle time of 48.125 ns, and operating temperature range from 0 °C to 85 °C. The modules use 240‑pin DIMM form factor with gold contacts and include a heat spreader for improved thermal performance.
| Capacity | 8 GB (2 × 4 GB) |
|---|---|
| Type | DDR3‑1600MHz CL9 240‑Pin DIMM Kit |
| Operating Voltage | 1.5 V (1.425 V ~ 1.575 V) |
| CAS Latency | CL9 |
| Row Cycle Time (tRCmin) | 48.125 ns |
| Row Active Time (tRASmin) | 33.75 ns |
| Operating Temperature | 0 °C to 85 °C |
| Storage Temperature | -55 °C to +100 °C |
The kit provides a total of 8 GB, consisting of two 4 GB modules.
It operates at 1.5 V, with a tolerance of 1.425 V to 1.575 V.
The modules are rated for operation from 0 °C up to 85 °C.
Yes, it supports Kingston HyperX Plug and Play (PnP) when the BIOS provides the feature.