XF2C Rotational Back Lock Type (0.3 mm pitch top contact type) achieves 0.3 mm pitch and connector height of 0.9 mm through a rotational back lock.
The manual explains the spin‑after‑lock mode for the XF2C series, specifying a 0.3 mm contact spacing and a contact height of 0.9 mm. It also details the FPC thickness (1t = 0.12 mm) and the material used for the connector housing (LCP resin, UL94‑V0).
Technical data include a maximum contact resistance of 80 mΩ (DC20 mV, 100 mA), a rated current of 0.2 A, an operating temperature range of –30 °C to +85 °C, and an expected mechanical life of 10 000 cycles. Dimensional tables list the various XF2C‑xxxx‑41A model sizes. This manual is written in Japanese.
| Contact spacing | 0.3 mm |
|---|---|
| Contact height | 0.9 mm |
| Maximum contact resistance | 80 mΩ (DC20 mV, 100 mA max) |
| Rated current | 0.2 A |
| Housing material | LCP resin, UL94‑V0 |
| Operating temperature range | -30 °C to +85 °C |
| Mechanical life | 10 000 cycles |
| FPC thickness (per layer) | 0.12 mm |
The contact spacing is 0.3 mm.
The maximum contact resistance is 80 mΩ (with a DC voltage of 20 mV and a current up to 100 mA).
It can operate from –30 °C up to +85 °C.
Each FPC layer is 0.12 mm thick (1t = 0.12 mm).