This application note will illustrate the new features of the LPC11U6x device family compared to the LPC11U3x device family.
This document serves as an application note comparing the LPC11U6x and LPC11U3x device families from NXP Semiconductors. It highlights the new features introduced in the LPC11U6x series, which is based on the ARM Cortex-M0+ processor, compared to the LPC11U3x series based on the ARM Cortex-M0 processor.
The note details specific improvements across various hardware components, including increased memory sizes, expanded operating temperature ranges, enhanced USB controllers with integrated termination resistors, and improved analog-to-digital converters. It also covers differences in package options, GPIO configurations, and peripheral capabilities such as I2C, UART, and DMA controllers.
| Processor Core | ARM Cortex-M0+ (LPC11U6x) / ARM Cortex-M0 (LPC11U3x) |
|---|---|
| Flash Memory (LPC11U6x) | Up to 256 kB |
| SRAM (LPC11U6x) | Up to 32 kB + 2x 2 KB blocks |
| Operating Temperature (LPC11U6x) | -40 °C to +105 °C |
| GPIO Pins (LPC11U6x) | Up to 80 |
| I2C Interfaces | Two |
| USARTs | Five |
| ADC Resolution | 12-bit |
| ADC Conversion Rate | 2 MSamples/s (VDD = 2.7 V to 3.6 V) |
The LPC11U6x uses an ARM Cortex-M0+ processor with a two-stage pipeline and single-cycle multiplier, while the LPC11U3x uses an ARM Cortex-M0 processor.
The LPC11U6x supports up to 256 kB of flash and 32 kB of SRAM, whereas the LPC11U3x supports up to 128 kB of flash and 12 kB of SRAM.
The LPC11U6x operates from -40 °C to +105 °C, while the LPC11U3x operates from -40 °C to +85 °C.
Yes, the LPC11U6x USB pads include internal SoftConnect and 33 series termination resistors, reducing the need for external components.