Fairchild Semiconductor FDZ191P P-Channel MOSFET Datasheet

FDZ191P P-Channel 1.5V PowerTrench® WL-CSP MOSFET features a maximum RDS(on) of 85 mΩ, occupies only 1.5 mm2 of PCB area, is less than 0.65 mm in height when mounted to PCB, and is RoHS compliant. It is ideal for battery management, load switch, and battery protection applications.


Fairchild Semiconductor FDZ191P P-Channel MOSFET Datasheet - cover page
Brand
Fairchild
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
7
File format
PDF
File size
248 KB
Published
12 July, 2012
Updated
30 September, 2023
MD5 checksum
33407FCC5F0A4C1072755CCE84DBDDD3

About this manual

This document is a technical datasheet for the FDZ191P, a P-Channel MOSFET designed on Fairchild's advanced 1.5V PowerTrench process. The device features state-of-the-art low pitch WLCSP packaging to minimize PCB space and reduce on-resistance (Rds(on)).

Key specifications include a maximum drain-to-source voltage of -20V, continuous drain current of ±1A, and an ultra-thin package height of less than 0.65 mm when mounted to the PCB. The datasheet provides detailed electrical characteristics, typical performance graphs, thermal resistance data, and mechanical dimensions for the WL-CSP package.

What's inside

  • Features
  • General Description
  • Maximum Ratings
  • Thermal Characteristics
  • Electrical Characteristics
  • Typical Characteristics
  • Package Marking
  • Ordering Information

Specifications

Power Dissipation (Ta=25°C)1.9 W
Operating Junction Temperature Range-55 to +150 °C
Package TypeWL-CSP

Frequently asked questions

What is the maximum drain current of the FDZ191P?

The continuous drain current rating is ±1 A.

Is the FDZ191P RoHS compliant?

Yes, the device is listed as RoHS Compliant.

What is the height of the FDZ191P package when mounted to a PCB?

The ultra-thin package has a height of less than 0.65 mm.

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