This document is a design support document for the VSONxxxV series of products, which introduces the features and characteristics of the series
This design support document from ROHM describes the VSON xxxV series semiconductor package. It covers the package structure, material composition, tape and reel packaging, storage conditions, marking, footprint dimensions and recommended soldering profiles.
Key sections include detailed dimensions for land pitch and package size, recommended reflow temperature curves, storage temperature and humidity limits, and packaging specifications such as tape dimensions, reel layout and shipping style. The document also notes that wave soldering is not supported and provides guidance for mounting on flexible or narrow boards.
| Storage temperature | 5~30°C |
|---|---|
| Storage humidity | 40~70% RH |
| Storage period | 1 year |
| Maximum preheat temperature | 260°C |
| Soldering temperature range | 220°C to 230°C |
The recommended storage temperature is 5~30°C, humidity 40~70% RH, and the specified storage period is 1 year.
No, the wave soldering method is not supported.
Tape dimensions are shown in Figure 3 of the document.