This datasheet introduces the information of SONxxxV series, including package dimensions, pin distribution, etc.
This design support document provides detailed information about the ROHM SONxxxV series semiconductor packages. It covers package structure, material composition, tape‑and‑reel packaging specifications, storage conditions, marking conventions, footprint dimensions, and recommended soldering profiles.
The document also includes packaging and shipping guidelines, peelback strength of cover tape, and notes on board mounting considerations for flexible or narrow boards. All specifications are intended for designers integrating these components into electronic equipment.
| Recommended storage temperature | 5 °C – 30 °C |
|---|---|
| Recommended storage humidity | 40 % – 70 % RH |
| Specified storage period | 1 year |
| Cover tape peelback strength | 0.2 N – 0.7 N |
| Maximum preheating temperature (reflow) | 260 °C |
| Soldering temperature range | 220 °C – 230 °C |
The cover tape peelback strength is specified as 0.2 N to 0.7 N.