This document introduces the design support information for the VSONxxxX series products
This document provides technical information for the ROHM VSONxxxX series semiconductor packages. It describes the package structure, materials, tape‑and‑reel packaging, labeling, and recommended packing styles.
Additional sections detail storage conditions, marking lot numbers, footprint dimensions, and recommended soldering profiles, including temperature limits and handling precautions for flexible or narrow boards.
| Storage temperature | 5 to 30 °C |
|---|---|
| Storage humidity | 40 to 70 % RH |
| Storage period | 1 year |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Cover tape peelback speed | 300 + 10 mm/min |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Land pitch / length / width | 0.50 mm / 2.20 mm / 0.70 mm |
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Use a maximum temperature of 260 °C, preheat at 130 °C‑190 °C, and a soldering zone of 220 °C‑230 °C.
The cover tape should have a peelback strength of 0.2‑0.7 N and a peelback speed of 300 + 10 mm/min.