This document is a design support document for ROHM's VSONxxxV series, which introduces the packaging dimensions, pin definitions, and other information for the series.
This design support document provides detailed information on the VSONxxxV series semiconductor packages from ROHM. It covers package structure, materials, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering profiles.
The document also includes packing and shipping specifications, peel‑back strength of cover tape, and guidelines for mounting on flexible or narrow boards. All data are presented for engineers to integrate the components into their designs safely and reliably.
| Recommended storage temperature | 5‑30 °C |
|---|---|
| Recommended storage humidity | 40‑70 % RH |
| Specified storage period | 1 year |
| Cover tape peel‑back strength | 0.2‑0.7 N |
| Maximum reflow temperature | 260 °C |
| Soldering temperature range | 220‑230 °C |
Store the devices at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
No, the wave soldering method is not supported.