This document is for TO252, TO252S package dimensions of ROHM company
This document from ROHM supplies detailed technical data for the TO252 and TO252S surface‑mount packages. It covers package structure, material composition, tape‑and‑reel packaging, storage requirements, marking conventions, footprint dimensions, and recommended soldering conditions.
The information is intended for design engineers who need to integrate these packages into printed‑circuit‑board assemblies, offering dimensional drawings, recommended reflow profiles, wave‑solder parameters, and handling instructions.
| Recommended storage temperature | 5 to 30 °C |
|---|---|
| Recommended storage humidity | 40 to 70 % RH |
| Maximum storage period | 1 year |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Peelback speed | 300 mm/min (approx.) |
| Maximum reflow surface temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Solder iron temperature limit | ≤ 380 °C |
| Maximum number of re‑flow cycles | 2 |
The cover tape should have a peelback strength between 0.2 N and 0.7 N.