This document introduces ROHM USONxxxX series (E2) product design support information, including product characteristics, appearance, package, pin definition, application circuit, etc.
The document describes the USONxxxX series (E2) semiconductor package, covering its internal structure, materials, and mechanical dimensions. It includes detailed tape and reel packaging specifications, marking information, and recommended handling and storage conditions.
Additional sections give recommended soldering temperature profiles, peelback strength, and mounting guidelines for flexible or narrow boards, helping designers ensure reliable assembly and performance.
| Recommended storage temperature | 5 to 30°C |
|---|---|
| Storage period | 1 year |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Preheating temperature | 130°C to 190°C |
| Maximum reflow temperature | 260°C |
| Soldering temperature | 220°C to 230°C |
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
Preheating should be 130 °C to 190 °C, the maximum reflow temperature is 260 °C, and the soldering zone temperature is 220 °C to 230 °C.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.