This document is the datasheet for ROHM's passive components SSONxxxX series. It mainly introduces the product overview, characteristics, package dimensions, pin definitions, and application circuits.
The document describes the structure and materials of the SSONxxxX series package, including lead frame composition, die material, and molding resin. It also details tape and reel packaging, labeling, shipping style, and recommended storage conditions.
Technical guidance is given for soldering, with recommended reflow temperature profiles, pre‑heating and soldering zones, and notes on wave soldering incompatibility. Footprint dimensions, peel‑back strength, and drop‑out tolerances are also listed.
| Package dimensions (mm) | 0.65 x 1.20 x 0.50 x 0.22 |
|---|---|
| Recommended storage temperature | 5 to 30 °C |
| Recommended storage humidity | 40 to 70 % |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Pre‑heating temperature range | 130 to 190 °C |
| Soldering temperature range | 220 to 230 °C |
| Peelback strength | 0.2 to 0.7 N |
The recommended storage temperature is 5 °C to 30 °C, with humidity between 40 % and 70 %.
The maximum reflow temperature is 260 °C.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.