This manual introduces the package dimensions of SSON004X1010. If you need any specifications, please contact us.
This document describes the SSON004X1010 semiconductor package, including its internal structure, materials, and recommended handling. It provides detailed information on tape‑and‑reel packaging, labeling, and shipping requirements.
Additional sections cover storage conditions, footprint dimensions, and recommended soldering profiles for both reflow and wave processes (the latter not supported). The guide also includes safety notices and contact information for further technical support.
| Package dimensions (L×W×H) mm | 0.65 × 0.50 × 0.40 × 0.25 |
|---|---|
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % |
| Specified storage period | 1 year |
| Reflow preheating temperature | 130 °C to 190 °C |
| Reflow soldering temperature | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to 1 year.
Preheating should be up to 130 °C‑190 °C, followed by a soldering zone of 220 °C‑230 °C.
Yes, the document includes a figure showing the tape dimensions for the SSON004X1010 package.
No, the wave soldering method is not supported for the SSON004X1010 package.