This design support document introduces the pin arrangement, dimensions and package form of VSONxxxX series.
This design support document provides detailed information on the VSONxxxX series (E2) semiconductor package from ROHM. It describes the package structure, materials, tape‑and‑reel packaging, storage conditions, marking conventions, footprint dimensions and recommended soldering profiles.
The document also includes packing and shipping specifications, peel‑back test methods, and handling notes for flexible or narrow PCBs. A notice section at the end outlines usage restrictions and safety considerations for the product.
| Package type | VSONxxxxX series (E2) |
|---|---|
| Lead frame material | Cu Alloy (Pb‑free solder plating) |
| Die material | Silicon |
| Wire material | Au |
| Molding material | Epoxy Resin |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
The maximum reflow soldering temperature is 260 °C.
Preheating should be performed at 130 °C to 190 °C.