This design manual provides details about the features, dimensions, packaging materials, pin configurations, packaging interfaces, packaging technologies, and packaging applications of the R1010A package for reference by design engineers.
The document presents the external package information for the ROHM WSOF6 semiconductor package. It includes a 3‑D view requirement, recommended conditions for viewing, and a brief description of the package dimensions and external features.
Legal notices outline copying restrictions, liability limits, and usage constraints, stating that the product is not intended for radiation‑tolerant or safety‑critical applications such as medical or aerospace equipment. Users are advised to follow safety measures and obtain appropriate licenses for export where required.
| Package | WSOF6 |
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No, the products specified in this document are not designed to be radiation tolerant.
No, copying or reproduction of the document, in part or in whole, is not permitted without ROHM's consent.
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