ROHM TT8U2 Datasheet

TT8U2 is a Pch +SBD MOSFET produced by Rohm. It has the characteristics of high switching speed and low on-resistance. The working voltage is 1.5V. It has a built-in low IR Schottky diode.


ROHM TT8U2 Datasheet - cover page
Brand
ROHM
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
6
File format
PDF
File size
475 KB
Published
01 June, 2012
Updated
30 September, 2023
MD5 checksum
CFE77D677F885A4DCB00A06E54BE4AA4

About this manual

The TT8U2 is a silicon P‑channel MOSFET combined with a Schottky barrier diode in a TSST8 package. It offers high‑speed switching, low on‑resistance, and can be driven at low voltage (1.5 V). The device includes a built‑in low‑current Schottky diode for reverse‑current protection.

Typical applications are switching circuits in audio‑visual equipment, office‑automation devices, communication gear and other general‑use electronic products. The datasheet includes packaging details, absolute maximum ratings, electrical characteristics, characteristic curves, and measurement circuit diagrams.

What's inside

  • Features
  • Applications
  • Packaging specifications
  • Absolute maximum ratings
  • Electrical characteristics
  • Characteristic curves
  • Measurement circuits
  • Notice

Specifications

Drain‑source voltage (VDS)-20 V
Gate‑source voltage (VGS)+10 V
Continuous drain current (ID)2.4 A
Pulsed drain current (ID,pulse)9.6 A
Power dissipation (PD)1.0 W
Junction temperature (Tj)150 °C
Gate‑source leakage current≤100 nA

Frequently asked questions

What is the maximum drain‑source voltage rating?

The device is rated for a drain‑source voltage of –20 V.

What is the typical gate‑source leakage current?

Gate‑source leakage is up to 100 nA under VGS = +10 V.

What is the continuous drain current capability?

The TT8U2 can conduct a continuous drain current of 2.4 A.

What is the power dissipation limit for the device?

Power dissipation is limited to 1.0 W per element.

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