This document introduces a connection technology that provides a high quality connection between a terminal and a wire at a relatively low applied cost.
The handbook introduces crimp technology as a replacement for soldered terminations, describing the three key elements—terminal, wire, and tooling—and the importance of proper setup for consistent quality. It explains how statistical process control (SPC) can be used to monitor and improve crimp performance.
It also defines critical attributes such as crimp height, bell mouth, conductor brush, and insulation crimp, and provides measurement methods, a wire gauge chart, and a troubleshooting guide to help users achieve acceptable crimp terminations.
| AWG 8 wire area | 8.302 sq.mm |
|---|---|
| AWG 10 wire area | 5.261 sq.mm |
| AWG 12 wire area | 3.308 sq.mm |
It provides general guidelines and procedures for understanding and achieving acceptable crimp terminations, including a glossary and tool list.
Pull‑force testing is a quick destructive method that evaluates the mechanical properties of a crimp; results outside the allowed range indicate process problems.