This document describes a chip bead (SMD) for signal lines, which has a standardized size for use with automatic assembly equipment, electroplated terminal electrodes for reflow soldering, high reliability due to a monolithic structure, a closed magnetic circuit structure to allow high-density installation and prevent crosstalk between circuits, a low DC resistance structure to prevent wasteful power consumption, and compliance with the RoHS directive. It is suitable for applications such as personal computers, CRTs, LCD panels, printers, hard disk drives, game machines, and cell phones.
The MMZ1005 series chip beads are designed for signal‑line applications such as personal computers, LCD panels, printers, hard‑disk drives, game machines, and cellular phones. They feature a standardized size for automatic assembly, electroplated terminals for reflow soldering, and a closed magnetic circuit that reduces crosstalk and power loss.
The document lists detailed electrical specifications (impedance, DC resistance, rated current), material options (B, S, Y, D, F), recommended soldering conditions, handling precautions, and packaging styles. All specifications are subject to change without notice and the product complies with the EU RoHS directive.
| Nominal impedance | 121:1200 at 100 MHz |
|---|---|
| Operating temperature range | -55 °C to +125 °C |
| Packaging style | T:Taping |
The soldering iron tip temperature should not exceed 350 °C and the soldering time should not exceed 3 seconds.
They are used in personal computers, CRTs, LCD panels, printers, hard‑disk drives, game machines, and cellular phones.