3M™ Thermally Conductive Silicone Interface Pads 5516/5516S, 5519/5519S, 5591S, 5592/5592S, 5595/5595S are used to transfer heat from hot surfaces or devices to cooler surface region of assembled devices.
These silicone‑filled thermal pads are designed to transfer heat from hot components to cooler regions of assembled devices. They offer excellent conformability, gap‑filling capability, and environmental durability, with thermal performance rated up to 150 °C.
The pads are supplied in multiple thicknesses (0.5 mm‑2.0 mm) and softness grades (Shore 00 values from 10‑80). Optional PET permanent film on one side creates a non‑tacky surface for easy rework and improves dielectric strength. Detailed specifications for each model are provided, including thermal conductivity, thermal impedance, dielectric strength, and volume resistivity.
| Shore 00 Hardness – Model 5519 | 80 |
|---|---|
| Maximum Short‑Term Operating Temperature | 150 °C |
| Maximum Long‑Term Operating Temperature | 100‑125 °C |