This document is about SOT318-1 PCB footprint information, introduces product dimensions, solder pads, etc.
This document provides the PCB footprint data for the Philips SOT318-1 QFP80 semiconductor package. It is intended for designers who need the exact pad layout and dimensions for reflow soldering.
The generic footprint pattern and detailed dimensions in millimetres are listed, and users are directed to the package outline drawing for the final layout. The reference file name for the footprint is S0T318-1_fp_reflow.
The footprint reference file is named S0T318-1_fp_reflow.
It was published on 21 December 2004.