NXP's payment solutions offer financial institutions, card manufacturers and consumers a variety of secure, reliable and attractive solutions.
The leaflet describes NXP's portfolio of dual‑interface and contactless integrated circuits designed for banking, transport ticketing, loyalty and mobile payment applications. It highlights the variety of form factors (cards, key fobs, USB tokens, mobile phones) and the high security level (CC EAL 5+, EMVCo approval) that meet global payment standards.
Technical details include memory capacities, supported voltage classes, CPU core, and optional cryptographic coprocessors. The document also notes certifications, compliance with MasterCard® and Visa® specifications, and the extensive deployment history of NXP SmartMX chips.
| EEPROM size | 6 KB – 144 KB |
|---|---|
| ROM size | 64 KB – 264 KB |
| Supported voltage classes | Class C, B (+ extended B) and A (1.62 V‑5.5 V) |
| CPU core | Secure_MX51 (enhanced 80C51) |
| Triple DES coprocessor | 64‑bit parallel |
| AES coprocessor (optional) | 128‑bit parallel |
| PKI coprocessor (optional) | RSA, ECC up to 4096 bits |
The ICs are certified to CC EAL 5+ and are EMVCo approved.
EEPROM ranges from 6 KB to 144 KB and ROM from 64 KB to 264 KB.
They support voltage classes C, B (+ extended B) and A, covering 1.62 V to 5.5 V.
Yes, they support MasterCard® and Visa® compliance and meet EMV specifications.