Kingston's KHX1600C9D3K3/6GX is a kit of three 256M x 64-bit (2GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8 memory modules, based on eight 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 6GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.
The Kingston KHX1600C9D3K3/6GX kit consists of three 2 GB DDR3‑1600 CL9 240‑pin DIMM modules. It complies with JEDEC standards, operates at 1.5 V (1.425 V ~ 1.575 V), and supports Intel® XMP profiles for enhanced performance.
Key specifications include a CAS latency of 9 cycles, operating power of 0.795 W per module, and temperature ranges of 0 °C to 85 °C (operating) and –55 °C to +100 °C (storage). The modules feature gold contacts, on‑die termination, and a heat spreader for improved thermal management.
| Capacity | 6 GB (3 × 2 GB) |
|---|---|
| Memory Type | DDR3‑1600 CL9 240‑Pin DIMM |
| CAS Latency (CL) | 9 cycles |
| Row Cycle Time (tRCmin) | 49.5 ns |
| Refresh to Active/Refresh | 160 ns |
| Row Active Time (tRASmin) | 36 ns |
| Operating Power | 0.795 W per module |
| Operating Temperature | 0 °C to 85 °C |
| Storage Temperature | -55 °C to +100 °C |
| Supply Voltage | 1.5 V (1.425 V ~ 1.575 V) |
| Module Height | 30.00 mm |
The kit provides a total capacity of 6 GB, made up of three 2 GB modules.
It operates safely from 0 °C up to 85 °C.
Each module consumes about 0.795 W of power.
Yes, each module kit supports Intel® XMP for higher memory speeds.