This document is the memory module specifications for Kingston KHX1866C9D3T1K2/4GX memory module
The KHX1866C9D3T1K2/4GX kit consists of two 2 GB DDR3‑1866 CL9 SDRAM modules, each built from sixteen 128 M × 8‑bit FBGA components. The modules support Intel® XMP and are rated for operation at 1.65 V with JEDEC‑standard timings at 1.5 V.
Key features include JEDEC‑standard 1.5 V power supply, 8‑bit pre‑fetch, programmable CAS latency, on‑die termination, and RoHS compliance. The modules are 240‑pin DIMMs with gold contacts and a heat spreader, designed for operating temperatures from 0 °C to 85 °C.
| CAS Latency (CL) | 9 cycles |
|---|---|
| Row Cycle Time (tRCmin) | 49.5 ns (min.) |
| Power Consumption | 1.800 W per module |
| Operating Temperature | 0 °C to 85 °C |
| Storage Temperature | -55 °C to +100 °C |
| Supply Voltage | 1.5 V ± 0.075 V |
The kit provides a total capacity of 4 GB.
Yes, each module kit supports Intel® XMP (Extreme Memory Profiles).
The module requires a +1.5 V supply (JEDEC standard).
The modules operate between 0 °C and 85 °C.