This document describes Kingston's KHX1866C9AD3T1K3/6GX product, which is a kit of three 2GB DDR3-1866 CL9 SDRAM memory modules that support Intel XMP. The total capacity of the kit is 6GB. Each module kit has been tested to run at DDR3-1866 with a low latency timing of 9-11-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The product complies with JEDEC standard electrical and mechanical specifications.
This document provides the technical specifications for Kingston's KHX1866C9AD3T1K3/6GX memory module kit, which consists of three 2 GB DDR3-1866 CL9 DIMM modules for a total capacity of 6 GB. It includes details on electrical characteristics, timing parameters, power consumption, and operating temperature ranges.
Additional information covers module dimensions, heat spreader design, and XMP profile settings. The sheet also notes compliance with JEDEC standards and provides a reference document number for further inquiry.
| Memory speed | DDR3-1866MHz |
|---|---|
| CAS latency (CL) | 9 cycles |
| Operating voltage | 1.5 V (1.425 V ~ 1.575 V) |
| Power consumption (per module) | 0.795 W |
| Operating temperature | 0 °C to 85 °C |
| Row Cycle Time (tRCmin) | 49.5 ns (min.) |
| Refresh to Active/Refresh | 160 ns (min.) |
| Module height | 2.401 in (61.00 mm) |
It operates from 0 °C up to 85 °C.
The modules use a JEDEC standard 1.5 V supply (range 1.425 V ~ 1.575 V).
The CAS latency is CL9, which equals 9 cycles.