Describes the features and characteristics of the Kingston KHX1600C9D3T1K2/8GX memory module, including support for Intel XMP technology, memory capacity, memory type, timing, and voltage.
This document provides detailed specifications for the Kingston KHX1600C9D3T1K2/8GX 8 GB DDR3‑1600 CL9 memory module kit, including electrical timing parameters, power consumption, and temperature limits. It also lists physical dimensions and construction details such as PCB height and heat spreader.
The sheet notes JEDEC‑standard operating voltage, programmable CAS latency options, and recommended operating and storage temperature ranges. It includes a disclaimer about system compatibility and overclocking risks.
| CAS Latency (CL) | 9 cycles |
|---|---|
| Row Cycle Time (tRCmin) | 49.5 ns (min) |
| Power (Operating) | 1.410 W per module |
| Operating Temperature | 0°C to 85°C |
| Storage Temperature | -55°C to +100°C |
| PCB Height | 2.401 inches (61.00 mm) |
| Operating Voltage | 1.5 V (JEDEC standard) |
It uses the JEDEC standard 1.5 V supply (range 1.425 V to 1.575 V).
The module supports programmable CAS latency of 9, 8, 7, or 6.
Operating temperature is 0 °C to 85 °C, and storage temperature is –55 °C to +100 °C.