This document is about the specifications of memory module KHX1600C9D3K2/4GX, which is based on DDR3-1600MHz CL9 SDRAM and supports Intel® XMP (Extreme Memory Profiles).
The KHX1600C9D3K2/4GX is a kit of two 2 GB DDR3‑1600MHz CL9 DIMM modules, providing a total capacity of 4 GB. Each module uses 240‑pin gold‑contact fingers, operates at 1.5 V (standard) or 1.65 V for the high‑performance timing of 9‑9‑9‑27, and supports Intel® XMP profiles.
Key features include JEDEC‑standard voltage, on‑die termination, programmable latency settings, and a heat spreader option. The modules meet specified electrical, mechanical, and thermal limits for reliable operation in compatible systems.
| Total kit capacity | 4 GB |
|---|---|
| Module capacity per DIMM | 2 GB |
| Memory type | DDR3-1600MHz CL9 |
| Latency timing (high‑performance) | 9‑9‑9‑27 at 1.65 V |
| Standard JEDEC timing | 9‑9‑9 at 1.5 V |
| Operating voltage | 1.5 V ± 0.075 V |
| Power consumption per module | 1.800 W |
| Operating temperature | 0 °C to 85 °C |
| Storage temperature | -55 °C to +100 °C |
| CL (IDD) cycles | 9 cycles |
| Row Cycle Time (tRCmin) | 49.5 ns (min.) |
| Row Active Time (tRASmin) | 36 ns (min.) |
| Refresh to Active/Refresh | 110 ns |
The kit provides a total capacity of 4 GB, consisting of two 2 GB modules.
Each module operates at a standard JEDEC voltage of 1.5 V (±0.075 V).
The modules are tested at a latency of 9‑9‑9‑27 when run at 1.65 V.
They are rated for operation from 0 °C up to 85 °C.