This document provides a comprehensive parts list for the Molex XFP Cage Assembly that is supplied without an elastomer EMI gasket. It includes part numbers, mechanical dimensions, optional heat‑sink configurations and general tolerances.
Key information such as maximum power ratings for PCI, SAN and tall heat‑sink options, insertion force requirements and dimensional tolerances are presented in tabular form for easy reference during design and procurement.
| PCI heat sink power rating | up to 15 W, thermal resistance <18.0 °C/W |
|---|---|
| SAN heat sink power rating | up to 25 W, thermal resistance <15 °C/W |
| Tall heat sink power rating | up to 35 W, thermal resistance <8.0 °C/W |
The assembly can be fitted with a PCI heat sink (up to 15 W, <18.0 °C/W), a SAN heat sink (up to 25 W, <15 °C/W) or a tall heat sink (up to 35 W, <8.0 °C/W).