This document provides VQFP48, VQFP48C, VQFP64, VQFP80 package dimensions
The document describes the structure, materials, and packaging options for ROHM VQFP (48‑lead and 64‑lead) semiconductor packages. It includes tape‑and‑reel dimensions, packing styles, shipping methods, and labeling requirements.
Key technical sections cover recommended storage conditions, footprint dimensions, and detailed soldering profiles for reflow, wave, and hand soldering. The guide also lists peel‑back strength, speed, and handling notes to ensure reliable assembly of VQFP devices.
| Land pitch (VQFP48C) | 0.50 mm |
|---|---|
| Land length (VQFP48C) | 7.20 mm |
| Land width (VQFP48C) | 7.20 mm |
| Package height (VQFP48C) | 1.10 mm |
| Lead thickness (VQFP48C) | 0.25 mm |
| Land pitch (VQFP64) | 0.50 mm |
| Land length (VQFP64) | 10.20 mm |
| Land width (VQFP64) | 10.20 mm |
| Package height (VQFP64) | 1.20 mm |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Maximum storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range (reflow) | 130 °C to 190 °C |
| Wave soldering preheat temperature | 120 °C to 150 °C |
| Wave soldering solder temperature | 260 °C ±3 °C |
| Maximum solder‑iron temperature | ≤ 380 °C |
| Peel‑back strength (cover tape) | 0.2 N to 0.7 N |
| Peel‑back speed | 300 mm/min + 10 mm/min |
The recommended storage temperature is 5 °C to 30 °C.
The maximum reflow temperature is 260 °C.
Cover tape peel‑back strength should be between 0.2 N and 0.7 N.