This Design Support Document introduces the specifications and dimensions of ROHM QFP package, including QFP32, QFP44, QFP-A64 etc.
The document describes the structure and materials of ROHM QFP packages, including lead‑frame, die, wire and molding details. It also covers tape‑and‑reel packaging, labeling, and shipping styles.
Storage conditions, recommended reflow and wave‑soldering profiles, as well as solder‑iron settings are listed. Footprint dimensions and tape/reel dimensions for QFP32, QFP44 and QFP‑A64 are provided, along with peel‑back strength and other handling notes.
| Storage temperature range | 5 to 30°C |
|---|---|
| Storage humidity range | 40 to 70% RH |
| Specified storage period | 1 year |
| Reflow maximum temperature | 260°C MAX |
| Preheating temperature (reflow) | 130°C to 190°C |
| Solder‑iron temperature limit | ≤ 380°C |
| Lead frame plating | Pb‑free solder plating |
| Die material | Silicon |
| QFP32 land pitch | 0.80 mm |
| Peel‑back strength | 0.2 to 0.7 N |
| Wave soldering preheat temperature | 120°C to 150°C |
| Wave soldering peak temperature | 260°C +3°C |
The recommended storage temperature is 5 °C to 30 °C and the humidity should be kept between 40 % and 70 % RH.
The specified storage period is 1 year; after opening a dry‑packed package, it should be assembled within 168 hours.
The reflow profile allows a maximum temperature of 260 °C, with a preheating range of 130 °C to 190 °C.
QFP32 tape dimensions are 6.0 mm width, 95 mm length, and 60 mm height (per the tape dimension table).