This document provides information about the dimensions and packaging details of ROHM's HTQFP64V S package.
This document provides technical data for the ROHM HTQFP64V lead‑frame package. It covers package structure, material composition, tape‑and‑reel packaging, storage conditions, marking information, footprint dimensions and recommended soldering processes.
The information is intended for designers and manufacturers who need to integrate the HTQFP64V package into printed‑circuit‑board assemblies, ensuring proper handling, storage and reliable soldering.
| Package dimensions (L × W × H) | 12.04 mm × 10.0 mm × 1.25 mm |
|---|---|
| Recommended reflow peak temperature | 260 °C max |
| Storage temperature range | 5 °C to 30 °C |
| Storage humidity range | 40 % to 70 % RH |
| Solder‑iron temperature limit | ≤ 380 °C |
The HTQFP64V package should be stored at temperatures between 5 °C and 30 °C.
The reflow peak temperature should not exceed 260 °C.
Store the package at 40 % to 70 % relative humidity.