This document is a design support document from ROHM Co., Ltd. It provides information about the dimensions and package specifications of the UQFP series.
This design support document describes the structure, materials, packaging, storage conditions and recommended soldering processes for ROHM's UQFP semiconductor packages. It includes detailed tape‑and‑reel dimensions, marking information, and mechanical footprint data for the UQFP64, UQFP80 and UQFP100 variants.
Key technical data such as temperature and humidity limits, storage life, reflow and wave soldering profiles, and solder‑iron settings are provided to help designers integrate the packages into printed‑circuit‑board assemblies safely and reliably.
| Storage temperature range | 5 to 30°C |
|---|---|
| Storage humidity range | 40 to 70% RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260°C |
| Preheating temperature (reflow) | 130°C |
| Soldering temperature (reflow) | 220°C |
| Wave soldering preheat temperature | 120°C to 150°C |
| Wave soldering solder temperature | 260°C ±3°C |
| Solder‑iron temperature limit | ≤ 380°C |
| Land pitch (UQFP64) | 0.40 mm |
Preheat at 120 °C to 150 °C for up to 60 seconds, then solder at 260 °C ± 3 °C for a maximum of 12 seconds.
The land pitch for the UQFP64 package is 0.40 mm.