This document is the design support document for TQFPxxV, which mainly introduces the package dimensions, pin definitions and other information of TQFPxxV
This document provides technical information for the ROHM TQFPXXV semiconductor package. It includes details on the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions and recommended soldering processes.
The guide also specifies packaging dimensions, peel‑back strength, missing‑IC allowances and safety notices, helping designers integrate the component into mass‑production circuits while maintaining reliability.
| Recommended storage temperature | 5 to 30 °C |
|---|---|
| Recommended storage humidity | 40 to 70 % RH |
| Specified storage period | 1 year |
| Reflow preheating temperature | 130 °C to 190 °C |
| Reflow soldering temperature | 220 °C to 230 °C |
| Wave soldering preheat temperature | 120 °C to 150 °C |
| Wave soldering peak temperature | 260 °C + 3 °C |
| Solder‑iron temperature limit | ≤ 380 °C |
| Land pitch (TQFP48V) | 0.50 mm |
| Maximum bake cycles for solderability | 2 times |
The tape dimensions for TQFP48V are 1500 mm length, 6.95 mm width, 7.75 mm height, with a pitch of 9.9 mm and a tolerance of ±0.1 mm.
The package may be baked a maximum of two times to restore solderability.