This document is a design support document from ROHM Co., Ltd. about TQFP package, which provides information about the dimensions and package details of TQFP64U and TQFP80U packages.
This document supplies technical information for the ROHM TQFPXXU semiconductor package. It covers package structure, materials, tape‑and‑reel packing, storage conditions, marking codes, footprint dimensions, and recommended soldering profiles.
Additional sections describe packing styles, shipping box dimensions, and detailed package dimensions for each TQFP variant (64U, 80U, 100U, 120U, 128U, 176U). Legal notices and usage cautions are included at the end.
| Storage temperature range | 5 to 30°C |
|---|---|
| Maximum storage period | 1 year |
| Maximum preheating temperature | 260°C |
| Preheating temperature range | 130°C to 190°C |
| Soldering temperature range | 220°C to 230°C |
| Maximum soldering cycles | 2 times |
The recommended storage temperature is 5 to 30°C.
They can be stored for up to 1 year.
The maximum preheating temperature is 260°C, with a typical range of 130°C to 190°C.
The soldering temperature should be between 220°C and 230°C.