ROHM TQFPXXU Design Support Document

This document introduces the dimensions, pin positions, and pin spacing of ROHM's TQFPxxU packages, including 64, 80, 100, and 128 pin types.

Brand: ROHM
Category: Other Electronics
Document type: Datasheet
Language: English
Pages: 10
File format: PDF
File size: 967 KB
Published: 04 June, 2012
Updated: 30 September, 2023
MD5 checksum: 47F786444F524277E5A3373A1F3CC699
PDF: ROHM TQFPXXU Design Support Document PDF

About this manual

This document supplies technical information for the ROHM TQFPXXU semiconductor package series. It covers package structure, material composition, tape‑and‑reel packaging, storage conditions, marking conventions, footprint dimensions, and recommended soldering profiles.

Key data include recommended storage temperature (5‑30 °C), humidity (40‑70 % RH), storage life (1 year), and reflow soldering parameters (preheat up to 260 °C, soldering 220‑230 °C). Packing dimensions and shipping details for various package sizes (e.g., TQFP64U, TQFP80U) are also provided.

What's inside

Structure and materials
Tape and Reel information
Storage conditions
Marking lot number
Footprint dimensions
Soldering conditions
Packing style
Shipping box dimensions
Package dimensions

Specifications

Recommended storage temperature	5 to 30 °C
Recommended storage humidity	40 to 70 % RH
Specified storage period	1 year
Maximum preheat temperature (reflow)	260 °C
Reflow soldering temperature range	220 °C to 230 °C

Frequently asked questions

What is the recommended storage temperature range for TQFPXXU packages?

The packages should be stored at temperatures between 5 °C and 30 °C.

How long can the dry‑pack be stored before soldering?

After opening the dry pack, the package should be assembled within 168 hours; the overall storage period is specified as 1 year.

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