This document provides design support information on the SIP-M series packages, including package dimensions and pin spacing.
The ROHM SIP‑M Design Support Document describes the structure, materials, and packaging details of the SIP‑M semiconductor package series. It includes information on package dimensions, marking codes, and storage guidelines.
Key sections cover recommended soldering temperature profiles, wave‑soldering notes, and solder‑iron settings, as well as detailed footprint dimensions for board designers. The document also lists packing specifications, tube dimensions, and dehydrated weight per shipment.
| Package land pitch (SIP‑M12) | 2.54 mm × 0.96 mm |
|---|---|
| Package land pitch (SIP‑M16) | 1.778 mm × 0.96 mm |
| Preheating temperature | 120 °C to 150 °C, max 60 s |
| Reflow soldering temperature | 260 °C ±3 °C, max 12 s |
| Recommended storage temperature | 15 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Maximum storage period | 1 year |
| Package dimensions (SIP‑M16) | 29.8 ± 0.2 mm × 24.0 ± 0.1 mm × 4.7 ± 0.2 mm |
| Dehydrated weight per 300 pcs (SIP‑M12) | 7.06 g |
| Dehydrated weight per 300 pcs (SIP‑M16) | 7.22 g |
Preheat to 120 °C‑150 °C for up to 60 seconds, then reflow at 260 °C ± 3 °C for up to 12 seconds.