This document is a design support document from ROHM Co., Ltd., which provides information about the dimensions and package dimensions of VQFP packaged products.
This design support document describes the VQFP semiconductor package offered by ROHM. It covers package structure, material composition, tape and reel packaging, storage guidelines, footprint dimensions, and recommended soldering profiles.
The document also includes handling notes, packing styles, and shipping information to help designers integrate VQFP components into their products safely and reliably.
| Lead frame material | Cu‑Alloy (Pb‑free solder plating) |
|---|---|
| Die material | Silicon |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Reflow maximum temperature | 260 °C (max) |
| Soldering temperature range | 220 °C to 230 °C |
| Footprint dimensions VQFP48C | Land pitch 0.50 mm, land length 7.20 mm, land width 7.20 mm |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity, and the specified storage period is 1 year.
The VQFP48C tape dimensions are listed as 1500 units with a width of 6.0 mm and other detailed measurements in the document.