This Design Support Document (DSD) provides design information about ROHM SQFP-T package, including package dimensions, pin location diagram, and pin assignments diagram.
This design support document for the ROHM SQFP‑T semiconductor package details its structure, materials, and marking information. It includes tape‑and‑reel packaging specifications, storage environment guidelines, and labeling requirements.
The document also lists the footprint dimensions, recommended reflow and wave soldering profiles, and handling instructions such as peel‑back strength and missing‑IC tolerances. Shipping box dimensions and material recommendations are provided for safe transport.
| Package type | SQFP-T |
|---|---|
| Land pitch | 0.65 mm |
| Land length | 10.20 mm |
| Land width | 10.20 mm |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Units per shipping box | up to 5 unit boxes |
| Tape feed direction | E2 |
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
The maximum reflow temperature specified is 260 °C.
Up to five unit boxes may be placed in a single shipping box.
The tape direction of feed is marked as E2.