The HB56TW432D Series, HB56TW433D Series is a 4,194,304-word × 32-bit High Density Dynamic RAM Module from Samsung. It has a 72-pin Zig Zag Dual tabs socket type compact and thin package, a single supply of 3.3 V (±0.3 V), and high speed, low power dissipation, fast page mode capability and other features.
The HB56TW432D and HB56TW433D are 4 M × 32‑bit high‑density dynamic RAM SODIMM modules using eight 16‑Mbit DRAM chips in a 72‑pin Zig‑Zag dual‑tab package. The modules support single 3.3 V supply, high‑speed access times, low power dissipation, and fast page mode operation.
The document provides detailed specifications, pin‑out diagrams, absolute maximum ratings, DC characteristics, ordering information, and revision history for both the standard and L‑version parts.
| Capacity | 4 M × 32 bits (4,194,304‑word × 32‑bit) |
|---|---|
| Access time | 50 ns / 60 ns / 70 ns (max) |
| Package type | 72‑pin Zig‑Zag dual‑tab SODIMM |
| Package dimensions | 59.69 mm × 25.40 mm × 3.80 mm (L × H × T) |
| Operating temperature | 0 °C to +70 °C |
| Power dissipation | 8 W (max) |
The access time is 50 ns for the -5 version, 60 ns for the -6 version, and 70 ns for the -7 version.
The module measures 59.69 mm in length, 25.40 mm in height, and 3.80 mm in thickness.
The modules are rated for 0 °C to +70 °C.