This document describes the features and characteristics of MMBZ5221BS - MMBZ5259BS 200mW surface mount zener diodes. The product has planar die construction and dual isolated zeners in an ultra-small surface mount package, making it ideally suited for automated assembly processes.
The MMBZ5221BS‑MMBZ5259BS series are 200 mW surface‑mount Zener diodes offered in an ultra‑small SOT‑363 package. They feature planar die construction, dual isolated Zeners and are designed for automated assembly processes.
Key specifications include a forward voltage of 0.9 V at 10 mA, power dissipation of 200 mW, thermal resistance of 625 °C/W, and an operating temperature range from –65 °C to +150 °C. Moisture sensitivity is Level 1 per J‑STD‑020A and each device weighs approximately 0.006 g.
| Package | SOT‑363, molded plastic |
|---|---|
| Power Dissipation | 200 mW |
| Forward Voltage @ 10 mA | 0.9 V |
| Thermal Resistance (J‑A) | 625 °C/W |
| Operating Temperature Range | -65 °C to +150 °C |
| Moisture Sensitivity | Level 1 (J‑STD‑020A) |
| Weight | 0.006 g (approx.) |
The diodes are rated for 200 mW power dissipation.
They are supplied in a SOT‑363 molded‑plastic package.
The devices have a moisture sensitivity level of 1 per J‑STD‑020A.