LSF-SMT 135° PCB terminal block for lead-free soldering processes with innovative connection technology: ”Push In“
The LSF‑SMT 135° is a push‑in PCB terminal block designed for lead‑free soldering processes. It features a spring‑action release button for quick wiring and uses high‑temperature LCP insulation to meet IEC 664‑1 requirements. The compact, tape‑on‑reel packaging enables full integration into SMT lines.
The document lists technical data such as pitch options, voltage classes, rated currents, clamping area, and material details, as well as ordering numbers and drawing legends for each variant.
| Pitch options | 3.5, 3.81, 5.00, 5.08, 7.50, 7.62 mm |
|---|---|
| Voltage class | 160 V, 250 V, 500 V (IEC 664‑1) |
| Soldering post length | 15 mm (standard), 1.5 mm (low‑profile) |
| Maximum clamping area | 0.14 – 1.50 mm² |
| Insulation material | LCP (high‑temperature) |
| Number of pins | 5 |
The terminal block is offered with pitches of 3.5, 3.81, 5.00, 5.08, 7.50, and 7.62 mm.
It is available in 160 V, 250 V, and 500 V classes in accordance with IEC 664‑1.
Standard posts are 15 mm long, with a low‑profile option of 1.5 mm.