This document describes a semiconductor product with a white package, which can be used as an optical indicator and is suitable for backlighting, optical coupling into light pipes and lenses. It is compatible with various SMT assembly and reflow soldering methods. The product is also load dump resistant and can be used in lighting applications.
The Siemens SIDELED® family includes the LS, LO, LY, LG and LP A670 series. These surface‑mount LEDs are supplied in a white 12‑mm tape reel and are suitable for backlighting, optical coupling into light pipes and lenses, and as optical indicators. They meet DIN 40839 load‑dump and impulse‑resistance requirements and are compatible with all SMT assembly and reflow soldering processes.
Technical data cover emission wavelengths (557 nm – 635 nm), forward voltage (2.0 V typical), forward current (30 mA max), operating temperature (‑55 °C to +100 °C), and detailed optical parameters such as luminous intensity, viewing angle, and spectral bandwidth. Package dimensions, cathode markings, and pulse handling capabilities are also provided. This manual is written in German.