Hirose DF16 Series 0.5mm Pitch SMT Board to Board Connector Manual

A308 0.5mm Pitch SMT Board to Board Connector DF16 Series is a high reliability connector with miniaturization, slimming, high spring characteristic, click feeling, metal fitting and automatic mounting.


Hirose DF16 Series 0.5mm Pitch SMT Board to Board Connector Manual - cover page
Brand
HRS
Document type
User Manual
Language
English
Pages
6
File format
PDF
File size
181 KB
Published
02 May, 2012
Updated
30 September, 2023
Model
DF16
MD5 checksum
BE603C30ADF19903BB4A67B8BAE3368B

About this manual

The DF16 series provides 0.5 mm pitch board‑to‑board connections with a low profile stacking height of 2 mm or 2.5 mm, suitable for automatic mounting. Features include high contact reliability, click‑insertion feedback, metal fittings to prevent solder peel, and vacuum pick‑up areas for SMT assembly.

The manual lists detailed electrical specifications, recommended PCB footprints, carrier‑tape dimensions, and precise reflow and manual soldering conditions. Safety precautions address handling of exposed contacts, board warp limits, and cleaning procedures.

What's inside

  • Features
  • Product Specifications
  • Recommended PCB Footprints
  • Embossed Carrier Tape Dimensions
  • Precautions for Use

Specifications

Rated Current0.3 A
Operating Temperature Range-35 °C to +85 °C
Storage Temperature Range-10 °C to +60 °C
Rated Voltage50 V AC
Insulation Resistance500 MΩ min (measured at 100 V DC)
Contact Resistance≤ 50 mΩ (measured at 100 mA)

Frequently asked questions

What is the rated current of the DF16 series connector?

The connector is rated for a current of 0.3 A.

What temperature profile is recommended for reflow soldering?

Preheat to 150 °C for 30–90 s, then ramp to 240 °C, with a soldering zone at 235 °C ± 5 °C for up to 10 s, followed by a cooling zone at 220 °C for 10–20 s.

What soldering iron temperature should be used for manual soldering?

Set the soldering iron to about 300 °C and apply heat for roughly 3 seconds.

What is the maximum board warp allowed during SMT assembly?

Board warp should not exceed 0.2 mm in the connector centre area.

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