DF16 series products are 0.5mm pitch, board-to-board connectors with miniaturization, high reliability and click sensitivity.
The DF16 series offers a miniaturized 0.5 mm pitch board‑to‑board connector suitable for mobile phones, LCDs and other compact devices. It features a low‑profile design with stacking heights of 2.0 mm or 2.5 mm, a bellows‑type female contact for high reliability, and a click‑feel for easy mating verification. The connector includes a vacuum pick‑up area and embossed tape packaging to support automatic surface‑mount assembly.
Technical specifications include rated current of 0.3 A, rated voltage of 50 V AC, insulation resistance of at least 500 MΩ, and operating temperature range from –35 °C to +85 °C. Materials are polyamide resin (UL94V‑0) for the insulator and phosphor‑copper contacts with gold plating. Ordering information provides part numbers for various contact counts and stacking heights, and recommended PCB footprints and reflow profiles are supplied for reliable assembly.
| Rated Current | 0.3 A |
|---|---|
| Rated Voltage | 50 V AC |
| Insulation Resistance | ≥500 MΩ at 100 V DC |
| Withstand Voltage | 150 V AC for 1 min |
| Contact Resistance | ≤50 mΩ at 100 mA |
| Operating Temperature Range | -35 °C to +85 °C |
| Storage Temperature Range | -10 °C to +60 °C |
| Operating Humidity Range | 40 %–80 % |
| Storage Humidity Range | 40 %–70 % |
| Insulator Material | Polyamide resin (UL94V‑0) |
| Contact Material | Phosphor copper with gold plating |
The DF16 connector is rated for a current of 0.3 A.
A soldering iron temperature of 290 °C ± 10 °C for about 2 seconds is recommended.
The connector can operate from –35 °C up to +85 °C.